发明名称 Multi-function module
摘要 An embodiment is a method and apparatus to provide a multi-function module. A circuit board has a form factor and a connector edge corresponding to a first interface standard. The connector edge includes first and second groups of pin-outs that are mapped to pin-out assignments compatible with the first interface standard and a second interface standard, respectively. A first interface is provided on the circuit board for a first set of devices connected to the first group of pin-outs to operate according to the first interface standard. A second interface is provided on the circuit board for a second set of devices connected to the second group of pin-outs to operate according to the second interface standard.
申请公布号 US8028404(B2) 申请公布日期 2011.10.04
申请号 US20100818084 申请日期 2010.06.17
申请人 VIRTIUM TECHNOLOGY, INC. 发明人 HOANG PHAN
分类号 H05K3/30;H01R12/00;H01R43/00;H01R43/16;H05K1/00 主分类号 H05K3/30
代理机构 代理人
主权项
地址