发明名称 |
Pre-formed conductive bumps on bonding pads |
摘要 |
Apparatuses including pre-forming conductive bumps on bonding pads for probing and wire-bonding connections and methods for making the same are disclosed. A method may include providing a microelectronic die including a conductive bump formed on a bonding pad, and an insulating layer formed on at least a portion of a surface of the conductive bump, and probing the conductive bump to test the microelectronic die. Other embodiments are also described.
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申请公布号 |
US8030098(B1) |
申请公布日期 |
2011.10.04 |
申请号 |
US20080198659 |
申请日期 |
2008.08.26 |
申请人 |
MARVELL INTERNATIONAL LTD. |
发明人 |
LIOU SHIANN-MING;WU ALBERT;KAO HUAHUNG |
分类号 |
H01L21/66;G01R31/26 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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