| 摘要 |
Embodiments include but are not limited to apparatuses and systems including a microelectronic device including a die having an active surface, a conductive pillar formed on the active surface of the die, the conductive pillar having a side surface, and a molding material encasing the die and the conductive pillar, including covering the active surface of the die and the side surface of the conductive pillar. Methods for making the same also are described.
|
