发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKING OPTION AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate having a component side and a system side; coupling a first integrated circuit die on the component side; coupling stacking interconnects on the component side around the first integrated circuit die; forming a package body on the component side, the first integrated circuit die, and the stacking interconnects; forming vertical insertion cavities through the package body and on the stacking interconnects; and forming a trench, in the package body, adjacent to the vertical insertion cavities for reducing a package warping stress. |
申请公布号 |
KR20110107766(A) |
申请公布日期 |
2011.10.04 |
申请号 |
KR20110026438 |
申请日期 |
2011.03.24 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
LEE, SEONG MIN;MUN, SEONG HUN;HAN, BYUNG JOON |
分类号 |
H01L23/04;H01L23/12;H01L23/48 |
主分类号 |
H01L23/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|