发明名称 Molded component, electronic apparatus, and method of producing a molded component
摘要 A molded component includes: a primary molded layer including a boxlike base portion that has a width direction in a first direction, a length direction in a second direction, and a height direction in a third direction and includes a first surface protruding in the third direction and a second surface that forms a spatial portion on the other side of the first surface, and a pedestal portion protruding outwardly in parallel to the first direction and the second direction from a circumferential edge of the base portion; a secondary molded layer formed of an optically-transparent resin material, that is laminated on the primary molded layer and has the same width and length as the primary molded layer; and an in-mold layer formed between the primary molded layer and the secondary molded layer.
申请公布号 US8031462(B2) 申请公布日期 2011.10.04
申请号 US20090588427 申请日期 2009.10.15
申请人 SONY CORPORATION 发明人 KOBAYASHI FUJIO;TORIMOTO MASASHI;ARAI SHIZUO;KAJIKAWA KATSUHARU
分类号 H05K5/00 主分类号 H05K5/00
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