METHOD OF FORMING PACKAGE ON PACKAGE AND RELATED DEVICE
摘要
Provided is a method of forming a package-on-package. An encapsulation is formed to cover a wafer using a wafer level molding process. The wafer includes a plurality of semiconductor chips and a plurality of through silicon vias (TSVs) passing through the semiconductor chips. The encapsulant may have openings aligned with the TSVs. The encapsulant and the semiconductor chips are divided to form a plurality of semiconductor packages. Another semiconductor package is stacked on one selected from the semiconductor packages. The other semiconductor package is electrically connected to the TSVs.
申请公布号
KR20110107180(A)
申请公布日期
2011.09.30
申请号
KR20100026393
申请日期
2010.03.24
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KIM, TAE HOON;PARK, JIN WOO;CHOI, DAE YOUNG;KIM, MI YEON;LEE, SUN HYE