DISPERSION FOR APPLYING OF A METAL LAYER

摘要

THE PRESENT INVENTION RELATES TO A DISPERSION FOR APPLICATION OF METAL LAYER ON A SUBSTRATE THAT IS NOT ELECTRICALLV CONDUCTIVE, COMPRISING AN ORGANIC BINDER COMPONENT, A METAL COMPONENT WITH DIFFERENT METALS AND/OR METAL PARTICLE SHAPES, AND WITH A SOLVENT COMPONENT. THE INVENTION MOREOVER RELATES TO A PROCESS FOR PREPARATION OF THE DISPERSION, TO A PROCESS USING THE DISPERSION FOR PRODUCTION OF A METAL LAYER, IF APPROPRIATE STRUCTURED, AND TO THE RESULTANT SUBSTRATE SURFACES AND THEIR USE.