| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable package capable of suppressing the lowering of strength while surely maintaining a vacuum state in a cavity, and to provide a method of manufacturing the package. SOLUTION: A package 9 has a base substrate 2 and a lid substrate 3 which are anodically bonded with each other via a bonding material 35, and the cavity C formed between the base substrate 2 and the lid substrate 3, and a piezoelectric vibrating reed 4 can be sealed in the cavity C. In the package, an electrode recess 22 having an opening is formed at a short-side surface 2b of a bonding surface 2a of the base substrate 2, a takeout electrode 24 is formed in the electrode recess 22, and an insulating part 26 is formed on an outer surface 24a of the takeout electrode 24. COPYRIGHT: (C)2011,JPO&INPIT
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