| 摘要 |
PROBLEM TO BE SOLVED: To promote size reduction of an imaging module, and to improve reliability of electric connection and electric noise resistance by decreasing the number of components and connection spots. SOLUTION: The imaging module includes a solid-state image sensor chip having an imaging surface, a cover glass that covers the imaging surface, and a wiring board on which the solid-state image sensor chip is mounted, in which the solid-state image sensor chip and the wiring board have an overlap structure in which ends thereof are overlapped with each other, and a first electrode portion formed on the end of the solid-state image sensor chip and a second electrode portion formed on the end of the wiring board are electrically connected through a bump. COPYRIGHT: (C)2011,JPO&INPIT
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