发明名称 SEMICONDUCTOR DEVICE
摘要 A memory card has a wiring board, four memory chips stacked on a main surface of the wiring board, and a controller chip and an interposer mounted on a surface of the memory chip of the uppermost layer. The memory chips are stacked on the surface of the wiring board so that their long sides are directed in the same direction as that of the long side of the wiring board. The memory chip of the lowermost layer is mounted on the wiring board in a dislocated manner by a predetermined distance in a direction toward a front end of the memory card so as not to overlap the pads of the wiring board. The three memory chips stacked on the memory chip of the lowermost layer are disposed so that their short sides on which pads are formed are located at the front end of the memory card.
申请公布号 US2011233788(A1) 申请公布日期 2011.09.29
申请号 US201113158430 申请日期 2011.06.12
申请人 RENESAS ELECTRONICS CORPORATION 发明人 SHINOHARA MINORU;ARAKI MAKOTO;SUGIYAMA MICHIAKI
分类号 H01L27/12 主分类号 H01L27/12
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