发明名称 THERMOSETTING RESIN, COMPOSITION INCLUDING THE SAME, AND PRINTED BOARD FABRICATED USING THE SAME
摘要 A thermosetting resin including at least one repeating unit represented by the following Chemical Formula 1: wherein, in Chemical Formula 1, A is derived from a phenolic moiety, an anilinic moiety, or a combination thereof, L is C(O)O, C(O)NR′ wherein R′ is hydrogen, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C6 to C30 aryl group, or a substituted or unsubstituted C6 to C30 aryloxy group, an aromatic ester, an aromatic ester-imide, an aromatic ester-amide, an aromatic amide, or a combination thereof, Z is a substituted or unsubstituted aliphatic group including a double bond or a triple bond, a substituted or unsubstituted alicyclic group including a double bond or a triple bond, a substituted or unsubstituted aryl group including a double bond or a triple bond, (iso)cyanate, a derivative thereof, or a combination thereof, and n is an integer ranging from 1 to about 4.
申请公布号 US2011236701(A1) 申请公布日期 2011.09.29
申请号 US20100859425 申请日期 2010.08.19
申请人 SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG FINE CHEMICALS CO., LTD., 发明人 LEE JAE-JUN;JUNG MYUNG-SUP
分类号 B32B15/08;C08G73/06;C08K5/1515;C08K5/3415;C08L79/04;C09K19/52 主分类号 B32B15/08
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