A housing for an electronic device includes a ceramic patterned light transmitting portion and a ceramic light resistant portion surrounding the light transmitting portion. A thickness of the light transmitting portion is in a range from 0.2 mm to 1 mm. A thickness of the light resistant portion is at least 0.3 mm thicker than that of the light transmitting portion.
申请公布号
US2011235345(A1)
申请公布日期
2011.09.29
申请号
US20100965848
申请日期
2010.12.11
申请人
HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.;HON HAI PRECISION INDUSTRY CO., LTD.