METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a method of separating a substrate for growth from a semiconductor layer with good reproducibility even when the semiconductor layer formed on the substrate for growth is thin.

SOLUTION: A plurality of columns which are discretely distributed and made of a compound semiconductor are formed on upper surfaces of projection portions on a surface of the substrate for growth which have unevenness formed on the surface. A semiconductor layer is formed which is supported on the substrate for growth by the columns and made of a compound semiconductor. A support substrate is bonded onto the semiconductor layer. The substrate for growth is separated from the semiconductor layer.

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