发明名称 VISUAL INSPECTION METHOD OF SEMICONDUCTOR WAFER AND DEVICE THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a technology of solving such a problem that there is the case that no acceptable product chips are present on an entire wafer at an early stage of developing a semiconductor since a margin of a process decreases accompanied by the micro-fabrication of the semiconductor and the complexity of the process, it becomes difficult to satisfy conditions in the process, and when fixed point inspection is executed, a suitable reference image for relative inspection cannot be imaged. <P>SOLUTION: An averaging image is generated by the use of fixed point inspection images of a plurality of chips, the averaging image is evaluated by the use of information on a circuit design corresponding to a fixed point position, and it is decided whether or not the averaging image is a reference image. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011192766(A) 申请公布日期 2011.09.29
申请号 JP20100056912 申请日期 2010.03.15
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 TAKAGI YUJI;HARADA MINORU;NAKAGAKI AKIRA
分类号 H01L21/66;G01N23/225;H01L21/027 主分类号 H01L21/66
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