SEMICONDUCTOR WAFER AND ITS MANUFACTURE METHOD, AND SEMICONDUCTOR CHIP

摘要

A semiconductor wafer includes: a first semiconductor chip area formed with a semiconductor element; a second semiconductor chip area formed with a semiconductor element; and a scribe area sandwiched between the first and second semiconductor chip areas; wherein: the first semiconductor chip area includes a first metal ring surrounding the semiconductor element formed in the first semiconductor chip area; and the metal ring is constituted of a plurality of metal layers including a lower metal layer and an upper metal layer superposed upon the lower metal layer, and the upper metal layer is superposed upon the lower metal layer in such a manner that an outer side wall of the upper metal layer is flush with the outer side wall of the lower metal layer or is at an inner position of the first semiconductor chip area relative to the outer side wall of the lower metal layer.