| 摘要 |
An apparatus for cutting unit dose blisters from a blister card is provided. The apparatus may include a blade, a guillotine head and a card holder. The guillotine head may be operatively coupled to the blade. The guillotine head may be configured to move the blade through a range of motion that intersects a plane of a platform on which the blister card is positionable for cutting. The card holder may be operatively coupled to the guillotine head to hold the blister card against the platform in advance of the blade being moved through the plane of the platform. The blade may be biased to maintain a surface of the blade in contact with a cutting base at least until the blade intersects the plane of the platform.
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