发明名称 CONDUCTIVE POLYMER ADHESIVE USING NANOFIBER AND METHOD FOR PREPARING THE SAME
摘要 Disclosed is an adhesive for electronic packaging component for selectively conducting electrical connection parts of the electronic components, wherein a non-conductive polymer nanofiber structure having an irregularly shaped net structure is included in one or two or more adhesive layer, and a space defined by the adjacent nanofiber structures includes a portion in which one or more conductive particle is distributed. The adhesive prevents the free flow of the conductive particles in the polymer resin by suppressing the flow of the polymer resin and the flow of the conductive particle and has excellent mechanical strength by having a composite structure of the polymer resin and the polymer nanofiber structure having a net structure.
申请公布号 WO2011040752(A3) 申请公布日期 2011.09.29
申请号 WO2010KR06623 申请日期 2010.09.29
申请人 KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY;PAIK, KYUNG WOOK;CHUNG, CHANG KYU;SUK, KYOUNG LIM 发明人 PAIK, KYUNG WOOK;CHUNG, CHANG KYU;SUK, KYOUNG LIM
分类号 C09J7/02;B32B37/00;C09J7/04;C09J9/02;C09J11/00 主分类号 C09J7/02
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