A curable epoxy resin composition comprising (a) at least one epoxy resin; (b) at least one curing agent; and (c) at least one high molecular weight poly(propylene oxide) poiyol toughening agent; and a process for preparing the curable epoxy resin composition.
申请公布号
WO2011119216(A2)
申请公布日期
2011.09.29
申请号
WO2011US00522
申请日期
2011.03.22
申请人
DOW GLOBAL TECHNOLOGIES LLC;KARUNAKRAN, RADHAKRISHNAN;TURAKHIA, RAJESH, H.
