MICROSTRIP PHASE INVERTER

摘要

The disclosed microstrip phase inverter is provided with: a ground substrate wherein a slot is formed; a dielectric layer which is formed on the ground substrate; an extended first microstrip conducting wire which is connected to a signal line of a first port and which is laminated on the upper surface of one side of the dielectric layer; an extended second microstrip conducting wire which faces the first microstrip conducting wire, is connected to a signal line of a second port, and which is laminated on the upper surface of the other side of the dielectric layer; and first and second via pins which are connected between one end of each of the extended first and second microstrip conducting wires and the ground substrate and which transmit first and second currents. The slot is formed in the ground substrate so that the first and second currents, which flow, in the form of signals, through the ground substrate via the first and second via pins, are each insulated and separated from each other, and flow so as to form electric fields with the second and first microstrip conducting wires. The inverter, which is compact in size, enables the inversion of a signal phase without the need for an additional device which converts microstrip wiring.