发明名称 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM
摘要 <p>A pattern forming method comprising (i) a step of forming a film from a chemical amplification resist composition, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer, wherein the resist composition contains (A) a resin capable of increasing the polarity to decrease the solubility for an organic solvent-containing developer by the action of an acid, (B) at least one kind of a compound capable of generating a sulfonic acid represented by the specific formula upon irradiation with an actinic ray or radiation, and (C) a solvent.</p>
申请公布号 WO2011118824(A1) 申请公布日期 2011.09.29
申请号 WO2011JP57499 申请日期 2011.03.18
申请人 FUJIFILM CORPORATION;FUJII, KANA;TARUTANI, SHINJI 发明人 FUJII, KANA;TARUTANI, SHINJI
分类号 G03F7/004;G03F7/038;G03F7/039;G03F7/32;H01L21/027 主分类号 G03F7/004
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