| 摘要 |
<p>Reliability and yield of MTJ devices is improved by reducing surface roughness in the MTJ layers of the MTJ devices. Surface roughness is reduced by reducing surface roughness of layers below the MTJ layers such as the bottom electrode layer. Planarizing the bottom electrode layer through chemical mechanical polishing or etch back of spin-on material before depositing the MTJ layers decreases surface roughness of the bottom electrode layer and the MTJ layers. Alternatively, a capping layer may be planarized before deposition of the bottom electrode layer and MTJ layers to reduce surface roughness in the capping layer, the bottom electrode layer, and the MTJ layers.</p> |
