发明名称 SEMICONDUCTOR LIGHT EMITTING ELEMENT, AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting element and a method, for manufacturing the same which can suppress a leak current sufficiently. <P>SOLUTION: The semiconductor light emitting element includes: a laminate 20 having a light emitting part 23; a first electrode 30 selectively arranged on a first major surface 20a of the laminate 20; a second electrode 40 selectively arranged on a second major surface 20b on an opposite side to the first major surface 20a of the laminate 20; a support substrate 60 bonded on a side of the second major surface 20b of the laminate 20 through a bonding metal 61; a protective film 80 arranged on at least a side surface 20c except for the second major surface 20b of the laminate 20; and a dielectric film 50 provided between the bonding metal 61 and a region of the second major surface 20b not provided with the second electrode 40, and between the bonding metal 61 and a protective major surface 80a on the second major surface 20b side of the protective film 80. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011192675(A) 申请公布日期 2011.09.29
申请号 JP20100055029 申请日期 2010.03.11
申请人 TOSHIBA CORP 发明人 MURAMOTO EIJI
分类号 H01L33/32;H01L21/3065 主分类号 H01L33/32
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