| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a module which is more efficiently and reliably operated at a low temperature in a smaller size compared to a power supply module with inductors mounted outside a package or adjacent to other parts in the case of a specified output power rating, and to provide the module which can have a higher output power rating than the module with the inductors mounted outside the package or adjacent to other parts in the case of a specified size. <P>SOLUTION: A power supply module includes: a molded package; power supply parts disposed on the package; and inductors disposed on the power supply parts in the package. <P>COPYRIGHT: (C)2011,JPO&INPIT |
