发明名称 MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To solve such a problem that it is difficult to enhance strength of a molded object in the conventional molding methods. SOLUTION: A molding method includes a molding process S52 sequentially performing following processes over the a plurality of sectional elements: a layer forming process S521 of splitting a solid body being a molding object, into the plurality of sectional elements, and forming a layer for each sectional element using powder having characteristics of being cure by application of a first liquid; a first drawing process S522 of drawing the sectional element as a first sectional pattern on the layer with the first liquid, by applying the first liquid to the layer; a second drawing process S523 of drawing the sectional element as a second sectional pattern by applying, in a superposed manner, a second liquid having characteristics of being cured by irradiation with an ultraviolet ray to the first sectional pattern; and an exposing process S524 of irradiating the second sectional pattern with the ultraviolet ray. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011189662(A) 申请公布日期 2011.09.29
申请号 JP20100058837 申请日期 2010.03.16
申请人 SEIKO EPSON CORP 发明人 HIRAI TOSHIMITSU;OKAMOTO EIJI;ISHIDA KOHEI
分类号 B29C67/00 主分类号 B29C67/00
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