发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device having a spiral inductor in which an area of an insulation layer formed on a wiring board surface in the lower part thereof is defined. SOLUTION: The semiconductor device has a semiconductor substrate SB, an isolation oxide film 19 disposed in the main surface of the semiconductor substrate SB, a spiral inductor SI disposed on a region where the isolation oxide film 19 is formed with an interlayer insulation film held therebetween, and a dummy pattern region DMR disposed around the isolation oxide film 19 and isolated by an isolation oxide film PT having a plane view width smaller than that of the isolation oxide film 19 where the oxide film 19 is disposed in a region wider than that of the spiral inductor SI. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011193034(A) 申请公布日期 2011.09.29
申请号 JP20110150840 申请日期 2011.07.07
申请人 RENESAS ELECTRONICS CORP 发明人 MAEDA SHIGENOBU;MAEKAWA SHIGETO;IPPOSHI TAKASHI;IWAMATSU TOSHIAKI
分类号 H01L21/822;H01L27/04 主分类号 H01L21/822
代理机构 代理人
主权项
地址