发明名称 ELECTRODE PLATE MANUFACTURING APPARATUS
摘要 An electrode plate die-cutting apparatus comprises an master-plate support section (3) that can support a master plate for electrode plates on a support face (35) thereof; a drive unit that drives a cutter, which is arranged so as to have the blade thereof face the master-plate support section (3), in both the advancing and retreating directions; and a pressure adjustment unit (7) that sucks at the master plate on the support face (35), when the cutter is made to advance towards the master-plate support section (3) by the drive unit. The pressure adjustment unit (7) comprises, for example, piping (71), a first branching pipe (72), a first valve (75), and a decompression unit (74). Since the vicinity of the support face (35) is sucked at, the electrode plate is adsorbed and anchored to the support face (35) side, via penetration holes (94) formed on a sheet material (90).
申请公布号 WO2011118713(A1) 申请公布日期 2011.09.29
申请号 WO2011JP57193 申请日期 2011.03.24
申请人 MITSUBISHI HEAVY INDUSTRIES, LTD.;UEDA HISASHI 发明人 UEDA HISASHI
分类号 H01M4/04;B26D7/01;B26F1/40;H01M4/139 主分类号 H01M4/04
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