摘要 |
A semiconductor chip, (402) includes an array of electrical contacts, (412, 413) and multiple vias (416, 417) coupling at least one circuit in the semiconductor chip to the array of electrical contacts. A first one of the electrical contacts, (412) of the array of electrical contacts is coupled to N vias (416), and a second one of the electrical contacts (413) of the array of electrical contacts is coupled to M vias (417a, 4176). M and N are positive integers of different values. |
申请人 |
QUALCOMM INCORPORATED;GU, SHIQUN;NOWAK, MATTHEW MICHAEL;LISK, DURODAMI J.;TOMS, THOMAS R.;RAY, URMI;SUH, JUNGWON;CHANDRASEKARAN, ARVIND |
发明人 |
GU, SHIQUN;NOWAK, MATTHEW MICHAEL;LISK, DURODAMI J.;TOMS, THOMAS R.;RAY, URMI;SUH, JUNGWON;CHANDRASEKARAN, ARVIND |