发明名称 |
THREE-DIMENSIONAL NETWORK IN CMP PAD |
摘要 |
<p>The present disclosure is directed at a chemical-mechanical planarization polishing pad comprising interconnecting elements and a polymer filler material, wherein the interconnecting elements include interconnecting junction points that are present at a density of 1 interconnecting junction point/cm3 to 1000 interconnecting junction points/cm3, and wherein the interconnecting elements have a length between interconnection junction points of 0.1 microns to 20 cm.</p> |
申请公布号 |
SG173547(A1) |
申请公布日期 |
2011.09.29 |
申请号 |
SG20110056330 |
申请日期 |
2009.02.12 |
申请人 |
INNOPAD, INC. |
发明人 |
HSU, OSCAR, K.;LEFEVRE, PAUL;WELLS, DAVID ADAM;JIN, MARC C.;ALDEBORGH, JOHN, ERIK |
分类号 |
B24D11/00;B24B37/04;B24D3/26;H01L21/304 |
主分类号 |
B24D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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