| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve compactification of an optical modulator in which an optical element chip composed by causing a PLC to be butt connected to another waveguide optical element formed on an EO material substrate is housed in a package. <P>SOLUTION: The optical modulator 300 includes a PLC-LN modulator 330 in which PLC 320 is butt connected to an LN modulator 310, the package 340 having a projecting part 340A on which the LN modulator 310 is fixed, an input fiber 361 connected to an input port 311 of the LN modulator 310 through a lens 350 which is fixed on the package 340, and an output fiber 362 connected to an output port 321 of PLC 320 through a fiber block 370 which is connected to PLC 320. In the LN modulator 310, the input port 311 connected to the input fiber 361 through the lens, a branching circuit 312 for branching an input optical signal and a signal electrode 313 for applying a voltage for modulating the branched optical signal are formed. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
