发明名称 Three-Dimensional Semiconductor Memory Devices And Methods Of Fabricating The Same
摘要 Three-dimensional semiconductor memory devices and methods of fabricating the same. The three-dimensional semiconductor devices include an electrode structure with sequentially-stacked electrodes disposed on a substrate, semiconductor patterns penetrating the electrode structure, and memory elements including a first pattern and a second pattern interposed between the semiconductor patterns and the electrode structure, the first pattern vertically extending to cross the electrodes and the second pattern horizontally extending to cross the semiconductor patterns.
申请公布号 US2011233648(A1) 申请公布日期 2011.09.29
申请号 US201113072078 申请日期 2011.03.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SEOL KWANG SOO;PARK CHANJIN;HWANG KIHYUN;CHOI HANMEI;YOO DONGCHUL;HUR SUNGHOI;HWANG WANSIK;NAKANISHI TOSHIRO;PARK KWANGMIN;LEE JUYUL
分类号 H01L29/792;H01L21/28 主分类号 H01L29/792
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