| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance the heat dissipation performance of a power module which packages a bare chip of a power semiconductor on a substrate. <P>SOLUTION: The power module 10a includes a substrate 12; a conductive pad 14 provided on one face of the substrate 12; a power semiconductor 16 packaged on the one face of the substrate 12; a wire 18a which electrically connects the pad 14 to the power semiconductor 16; a thermal via 20 penetrating from the one face of the substrate 12 to the other face thereof; a heat conduction part 22a composed of a member higher in the heat conductivity than the substrate 12; and a radiator 24 provided on the other face side of the substrate 12. <P>COPYRIGHT: (C)2011,JPO&INPIT |
