| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device which can reduce warpage of a support substrate even when a multilayer wiring board is formed by building up a resin wiring layer on the support substrate. <P>SOLUTION: The method includes: a process for forming a lower layer portion 10 including a conductive via 11 and a first insulating part 12 for covering the via 11 on the support substrate 100; a process for forming an intermediate layer portion 30 including a first wiring 31 electrically connecting to the via 11, and a second insulating part 32 for covering the first wiring 31 on the lower layer portion 10. A process for forming the lower layer portion 10 includes a process for forming the first insulating part 12 on a first circuit forming region 110 for forming a circuit and a first region 120 for surrounding the first circuit forming region; and a process for forming the via 11 on the first circuit forming region 110. A process for forming the intermediate layer portion 30 includes: a process for forming the first wiring 31 on the first circuit forming region 110; a process for forming a film of the second insulating part 32 to cover the lower layer portion 10; and a process for removing the second insulating part 32 on the first region 120 so that an outer circumferential part 10a of an upper surface of the lower layer portion 10 is exposed. <P>COPYRIGHT: (C)2011,JPO&INPIT |
