发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a rounded interconnect on a package carrier having an integrated circuit attached thereto, the rounded interconnect having an actual center; forming an encapsulation over the package carrier covering the rounded interconnect; removing a portion of the encapsulation over the rounded interconnect with an ablation tool; calculating an estimated center of the rounded interconnect; aligning the ablation tool over the estimated center; and exposing a surface area of the rounded interconnect with the ablation tool.
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申请公布号 |
US2011233751(A1) |
申请公布日期 |
2011.09.29 |
申请号 |
US20100730989 |
申请日期 |
2010.03.24 |
申请人 |
BAE JOHYUN;MUN SEONGHUN;AHN SEUNGYUN |
发明人 |
BAE JOHYUN;MUN SEONGHUN;AHN SEUNGYUN |
分类号 |
H01L23/488;H01L21/66;H01L23/28 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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