<p>The present invention relates to a method for manufacturing a substrate that provides a uniform roughness to the rear face of the substrate using sand blasting. The method for manufacturing a substrate according to the present invention comprises: a slicing step for slicing an ingot in a wafer-shape; a sand blasting step for sand blasting at least one of the two faces of the substrate that has been sliced in a wafer-shape; a lapping step for lapping the two faces of the substrate, the lapping step being carried out between the slicing step and the sand blasting step; a heat treating step for heat treating the sand-blasted substrate; and a polishing step for mirror polishing the front face of the heat-treated substrate.</p>
