| 摘要 |
<p>13 PC-WP2OI0/052298METAL-COATED POLYIMIDE RESIN SUBSTRATE WITH EXCELLENT[Object] To provide a metal-coated polyimide resin substrate that doesnot deteriorate the initial adhesion between the metal-coated polyimide resin film and the metal layer and has high adhesion after aging at 150ºC for 168 hours.[Solution] A metal-coated poiyimide resin substrate in which a barrier layer is formed by a wet process after performing surface modification to one surface or both surfaces of a polyimide resin film by a wet process or a10 dry process or a combination thereof, a seed layer is thereafter formed by a wet process or a dry process, and a conductive film is formed on a surface layer thereof by a wet process; wherein; at the peeling surface on the conductive film layer side after the metal-coated polyimide resin substrate is subject to a 90-degree peel test, the thickness of a mixed layer of polyimide residue and barrier metal layer residue according to in-depth profiling with a time-of-flight secondary on mass spectrometer (TOF-SIMS) is 2.60 nm or less based on Si sputter rate conversion, and peel strength retention after an aging test at 150°C for 168 hours (peel strength after aging at 150°C for 168 hours/initial peel strength) is 50% or higher.20[Selected Drawing] Fig, 1</p> |
