发明名称 LASER BEAM MACHINING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus capable of executing forward machining and backward machining to a workpiece with similar machining quality. <P>SOLUTION: In the laser beam machining apparatus of a certain embodiment, a laser beam irradiation mechanism 5 includes a laser beam oscillator for oscillating a laser beam, a collective lens 541 for collecting the laser beam toward the workpiece W held on a holding mechanism 2, and a protective blow nozzle 53 for jetting a gas from a jetting port 531 to the workpiece W. The protective blow nozzle 53 is arranged such that the laser beam collected by the capacitor lens 541 can pass the jetting port 531 to irradiate the workpiece W, and the irradiation position of the laser beam for the workpiece W and the center position of the jetting port 531 are adjusted so that the amount of machining chips adhered to the workpiece W is almost the same in forward and backward machining executed by irradiating the workpiece W with the laser beam while relatively reciprocating the holding mechanism 2 and the laser irradiation mechanism 5 along a machining forwarding direction. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011189400(A) 申请公布日期 2011.09.29
申请号 JP20100060001 申请日期 2010.03.16
申请人 DISCO CORP 发明人 YOSHII SHUNGO;NISHINO YOKO
分类号 B23K26/14;B23K26/06 主分类号 B23K26/14
代理机构 代理人
主权项
地址