| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that improves reliability of transfer of a drive signal to a semiconductor element. <P>SOLUTION: The semiconductor device 30 includes the semiconductor element 13, a connector 17, a case 19, and an electrode 18. The semiconductor element 13 has a voltage-driven type power device for controlling an on operation and an off operation for a main current by inputting the drive signal. The connector 17 receives the drive signal while being not in contact with a sending part which transmits the drive signal, and transmits the drive signal to the semiconductor element 13. The case 19 accommodates the semiconductor element 13, and constitutes an external frame of the semiconductor device 30. The electrode 18 is positioned on an upper surface of the case 19 and also connected to the semiconductor element 13 to supply a main current. The connector 17 is embedded in a wall of the upper surface of the case 19. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
