| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer wiring board for forming a highly precise alignment mark while peeling at a lamination process is prevented. SOLUTION: In the manufacturing method of the multilayer wiring board, a peeling sheet 14 including copper foil 14a (metal layer) and copper foil 14b (base layer) is disposed on a support substrate 11. A first sheet on an outer peripheral side of a prescribed valid region of the peeling sheet 14 and second sheets corresponding to a plurality of alignment marks AM positioned at inner peripheral sides are removed, and resin material layers 20 are laminated and formed on upper parts of them. An end face including a peeling interface of the peeling sheet 14 is exposed and peeled and separated on the peeling interface with respect to a laminate before separation 10a where a build-up layer is formed by a lamination process. The multilayer wiring board can finally be obtained while the alignment mark AM having high position precision is used for the laminate after separation. COPYRIGHT: (C)2011,JPO&INPIT |
