发明名称 |
HEAT PROCESSING APPARATUS AND HEAT PROCESSING METHOD |
摘要 |
A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism.
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申请公布号 |
US2011236845(A1) |
申请公布日期 |
2011.09.29 |
申请号 |
US201113155013 |
申请日期 |
2011.06.07 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
AOKI SHIGEKI;SAKAI YUICHI;YAMASHITA MITSUO;SHINYA HIROSHI |
分类号 |
F24J3/00 |
主分类号 |
F24J3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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