METHOD FOR SLICING SYNTHETIC CORUNDUM SINGLE-CRYSTAL INGOT

摘要

The present invention relates to a method for slicing an ingot that can reduce slicing time and wire consumption when slicing a synthetic corundum single-crystal ingot having an R-axis direction. According to the present invention, the method for slicing an ingot is a method in which a cylindrical ingot having an R face (1-102) as the bottom face is sliced in a wafer shape, and the ingot is sliced in directions excluding directions parallel to a [-1-120] direction, a [11-20] direction, a [-1101] direction, and a [1-10-1] direction. In particular, the ingot would be more easily sliced if the ingot is cut in direction orthogonal to the face direction [1-102] of the bottom face thereof, while also being sliced at a direction parallel to one of the directions, the directions which form angles of 30°-60°, 120°-150°, 210°-240°, and 300°-330° with respect to the [-1-120] direction.