| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To increase strength against the disconnection of substrate wiring without deteriorating signal quality, and to improve reliability. <P>SOLUTION: An electronic component device (semiconductor device 100) includes: an electronic component (semiconductor chip 150) mounted to one surface of a substrate 110; and wiring 114 formed on the substrate 110 and formed while crossing from the inside to the outside of an outer edge 150a of the electronic component in a plan view. In the wiring 114, a wiring path crossing the outer edge 150a includes a portion extended to a second place on the outer edge 150a along the outer edge 150a from a first place on the outer edge 150a, and a distance between the first place and the second place is wider than a wiring width of the wiring 114. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
