CUTTING MACHINE, SLITTER PROVIDED WITH SAME, AND METHOD FOR CUTTING FILM

摘要

Disclosed is a cutting machine (10) that is provided with a suction roll (5) for suctioning film (9), and also provided with an irradiation apparatus (6) for cutting the film (9) by irradiating the film (9) with a laser beam. A plurality of vacuum holes (16) are formed on the suction roll (5), and the irradiation by laser beam from the irradiation apparatus (6) is directed toward the vacuum holes (16). The suction roll (5) is provided with an air suction apparatus for suctioning the film (9) to the surface (15) of the suction roll (5) by suctioning air through the vacuum holes (16).