| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable wiring board for inhibiting occurrence of a migration phenomenon and preventing occurrence of a failure in continuity. SOLUTION: The wiring board includes a conductor pattern formed by discharging conductor pattern forming ink containing metallic particles and a dispersion medium in which the metallic particles disperse by a droplet discharging method. It includes a multilayer substrate comprising a plurality of ceramic substrates stacked, the conductor pattern buried between the adjacent ceramic substrates, and a void formed partially around the conductor pattern of the multilayer substrate. A distance from the conductor pattern to the void preferably ranges from 0.3 to 5 times of an average thickness of the conductor pattern. An average thickness of the void preferably ranges from 0.5 to 3 times of the average thickness of the conductor pattern. COPYRIGHT: (C)2011,JPO&INPIT |
