发明名称 IMPLEMENTING ENHANCED LINK BANDWIDTH IN A HEADLESS INTERCONNECT CHIP
摘要 A method and circuit for implementing enhanced link bandwidth for a headless interconnect chip in a local rack interconnect system, and a design structure on which the subject circuit resides are provided. The headless interconnect chip includes a cut through switch and a store and forward switch. A packet is received from an incoming link to be transmitted on an outgoing link on the headless interconnect chip. Both the cut through switch and the store and forward switch are selectively used for moving packets received from the incoming link to the outgoing link on the headless interconnect chip.
申请公布号 US2011235652(A1) 申请公布日期 2011.09.29
申请号 US20100731715 申请日期 2010.03.25
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 HILLIER, III PHILLIP ROGERS;SHEDIVY DAVID ALAN;VALK KENNETH MICHAEL
分类号 H04L12/54;G06F17/50 主分类号 H04L12/54
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