发明名称 THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITION
摘要 A thermally conductive silicone rubber composition comprises: (A) an organopolysiloxane that contains at least two silicon-bonded alkenyl groups in each molecule, that does not contain silicon-bonded hydroxyl and alkoxy groups, and that has a content of cyclic siloxanes having from 4 to 20 siloxane units of not more than 1,000 ppm in mass units; (B) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule and that does not contain silicon-bonded alkenyl, hydroxyl group, and alkoxy groups; (C) an adhesion promoter; (D) a thermally conductive filler; and (E) a hydrosilylation reaction catalyst; wherein the total quantity of components (B) and (C) is from 0.5 to 10 mass% of the total quantity of components (A), (B), and (C). The composition is characterized by reduced oil fraction that bleeds out during the course of curing, and by reduced low-boiling fraction that volatilizes during the course of curing.
申请公布号 WO2011093353(A3) 申请公布日期 2011.09.29
申请号 WO2011JP51538 申请日期 2011.01.20
申请人 DOW CORNING TORAY CO., LTD.;KODAMA, HARUMI;ONISHI, MASAYUKI;SAKAGUCHI, RYO;NAKAYOSHI, KAZUMI 发明人 KODAMA, HARUMI;ONISHI, MASAYUKI;SAKAGUCHI, RYO;NAKAYOSHI, KAZUMI
分类号 C08L83/04;C08G77/20;C08K3/20;H01L21/52 主分类号 C08L83/04
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