发明名称 |
THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITION |
摘要 |
A thermally conductive silicone rubber composition comprises: (A) an organopolysiloxane that contains at least two silicon-bonded alkenyl groups in each molecule, that does not contain silicon-bonded hydroxyl and alkoxy groups, and that has a content of cyclic siloxanes having from 4 to 20 siloxane units of not more than 1,000 ppm in mass units; (B) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule and that does not contain silicon-bonded alkenyl, hydroxyl group, and alkoxy groups; (C) an adhesion promoter; (D) a thermally conductive filler; and (E) a hydrosilylation reaction catalyst; wherein the total quantity of components (B) and (C) is from 0.5 to 10 mass% of the total quantity of components (A), (B), and (C). The composition is characterized by reduced oil fraction that bleeds out during the course of curing, and by reduced low-boiling fraction that volatilizes during the course of curing. |
申请公布号 |
WO2011093353(A3) |
申请公布日期 |
2011.09.29 |
申请号 |
WO2011JP51538 |
申请日期 |
2011.01.20 |
申请人 |
DOW CORNING TORAY CO., LTD.;KODAMA, HARUMI;ONISHI, MASAYUKI;SAKAGUCHI, RYO;NAKAYOSHI, KAZUMI |
发明人 |
KODAMA, HARUMI;ONISHI, MASAYUKI;SAKAGUCHI, RYO;NAKAYOSHI, KAZUMI |
分类号 |
C08L83/04;C08G77/20;C08K3/20;H01L21/52 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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