CURING AGENT COMPOSITION FOR EPOXY RESIN BASED ADHESIVE, AND ADHESIVE FOR POROUS MATERIALS

摘要

An adhesive for porous materials which is composed of both a base resin that contains an epoxy resin and a curing agent composition, wherein the curing agent composition comprises: an aqueous polyaminoamide- or polyamide-type curing agent that has both a hydrophilic group and a lipophilic group; a tertiary amine; and water. The aqueous polyaminoamide- or polyamide -type curing agent is a product of condensation between a dimer or trimer acid and a polyaminoamide or a polyamide. The adhesive for porous materials is free from formaldehyde, has a long pot life, and can attain high bond strength in a short time.