| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of removing a deposition film surely in a short time. <P>SOLUTION: This method for manufacturing the semiconductor device including a weight part, an outer frame support part arranged so as to enclose the weight part across an opening part, and a beam part for connecting the weight part to the support part includes a substrate processing step for forming the weight part and the support part by etching a support substrate, a modifying step for modifying each side wall on each opening part side of the weight part and the support part in contact with a deposition film generated by etching in the substrate processing step, and a deposition film removing step for removing modified spots of each side wall together with the deposition film from the weight part and the support part respectively after the modifying step. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
