| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric conversion apparatus, capable of being extremely miniaturized in comparison with that manufactured using a bulk material, and to provide a method of manufacturing the same. SOLUTION: The thermoelectric conversion apparatus 11 is provided with: a substrate 1; and a pair of a p-type semiconductor film 2 and an n-type semiconductor film 3, which are provided on the substrate 1, and are bonded to each other at one terminal thereof. COPYRIGHT: (C)2011,JPO&INPIT |
