发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device including a shared contact which prevents opening defect of a contact hole and an increase in contact resistance, and prevents degradation of yields caused by generation of a junction leak current. SOLUTION: A source/drain region 106 is formed at both sides of a gate electrode 103 on a semiconductor substrate 100. The shared contact includes a lower level contact 113 that is connected to the source/drain region 106 and not connected to the gate electrode 103, and an upper level contact 118 connected to both the lower contact 113 and the gate electrode 103. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011192744(A) 申请公布日期 2011.09.29
申请号 JP20100056312 申请日期 2010.03.12
申请人 PANASONIC CORP 发明人 OIKAWA KOTA
分类号 H01L29/78;H01L21/28;H01L21/768;H01L21/8234;H01L21/8244;H01L23/522;H01L27/088;H01L27/11;H01L29/41;H01L29/417 主分类号 H01L29/78
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