发明名称 METHOD OF MANUFACTURING PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a package, capable of rapidly and unfailingly inserting a rivet body into a through-hole of a substrate without damaging the substrate, a low-cost piezoelectric vibrator manufactured by this method, an oscillator, an electronic apparatus, and a radio-controlled timepiece. SOLUTION: The manufacturing method has a rivet body arranging step S33 for inserting a core material of conductive rivet bodies 7 each having a planar base portion and a core material portion provided upright from the base portion in a normal direction into through-holes 30, 31 (recesses). The rivet body arranging step S33 includes placing the rivet bodies 7 on a first surface U (upper surface) of a base substrate wafer 40 (first substrate), and then relatively traversing a magnet portion 63 (magnet) disposed on a second surface L side (lower surface side) of the base substrate wafer 40 and the base substrate wafer 40. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011193289(A) 申请公布日期 2011.09.29
申请号 JP20100058431 申请日期 2010.03.15
申请人 SEIKO INSTRUMENTS INC 发明人 KUSANAGI YOSHIHIRO
分类号 H03H3/02;H01L23/04;H03B5/32;H03H9/02 主分类号 H03H3/02
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